Copper Clad Board Double Sided 10x15 - 1.6mm

Industrial-Grade FR4 Glass-Epoxy Matrix

Engineered for professional circuit design and reliable hardware prototyping, this single-sided copper clad laminate (CCL) is constructed from high-tensile woven fiberglass fabric impregnated with a flame-retardant epoxy resin binder. Meeting stringent UL94V-0 flammability standards, the 1.6mm thick FR4 substrate delivers superior flexural strength, minimal mechanical warping, and exceptional dimensional stability under severe environmental stress. Featuring a Glass Transition Temperature (Tg) rating of 130 degrees Celsius, this substrate maintains structural rigidity during high-heat soldering cycles, preserving trace alignment and preventing layer delamination.

High-Purity 1 oz Electrodeposited Copper Layer

The board features a pristine 1 oz per square foot (35 micron nominal thickness) electrodeposited copper layer bonded with high shear strength to the dielectric substrate. This uniform foil thickness offers optimized electrical conductivity, minimal DC resistance, and enhanced current capacity for trace paths. The micro-smooth surface profile supports high-resolution fine-pitch trace layouts, down to 6 mil line widths and spacing. The copper surface is optimized for rapid, uniform wet chemical etching using ferric chloride, cupric chloride, or ammonium persulfate, while demonstrating outstanding durability against mechanical stress during CNC isolation routing, laser ablation, and direct-to-copper thermal toner transfer methods.

Precision Dielectric and High-Frequency Characteristics

With a relative permittivity (dielectric constant, Dk) of approximately 4.35 at 1 MHz and a low dissipation factor (loss tangent, Df) of 0.02, this board provides consistent signal propagation velocities and predictable impedance characteristics for RF, analog, and mixed-signal prototype applications. The high dielectric breakdown voltage ensures maximum insulation resistance between adjacent unetched copper zones and ground planes, preventing parasitic capacitive coupling and trace-to-trace crosstalk in dense layout topologies.

Thermal Dissipation and Assembly Compatibility

Designed to withstand intense thermal shocks, the laminate demonstrates exceptional solder float resistance at 260 degrees Celsius for up to 30 seconds. The 1 oz copper layer serves as an effective heat spreader, distributing heat generated by power MOSFETs, linear regulators, and high-current LED arrays away from sensitive components. The surface easily accepts leaded and lead-free solder alloys, enabling seamless component integration through hand soldering, hot-air reflow, or wave soldering without oxidation or surface degradation.

Versatile Hardware Engineering Applications

Measuring 100mm by 150mm, this standard eurocard-proportioned panel provides an ideal platform for custom PCB prototyping, university electrical engineering research, low-volume production modules, and hardware development projects. Whether building high-frequency RF amplifiers, custom switched-mode power supplies, sensor interface boards, or micro-controller breakout shields, this single-sided FR4 panel delivers uncompromised performance and precision fabrication capabilities.