- Stock: In Stock
- Model: Copper Clad Board Single Sided 10x15 - 1.6mm
- Weight: 45.00g
- Dimensions: 150.00mm x 100.00mm x 1.60mm
- SKU: 292
High-Grade FR4 Glass-Reinforced Epoxy Substrate
Engineered for precision electronic prototyping, this 100mm x 150mm copper clad laminate board is constructed from premium FR4 woven fiberglass cloth impregnated with a flame-retardant epoxy resin binder. Featuring an industry-standard 1.6mm structural thickness, this board offers exceptional dimensional stability, high mechanical strength, and superior flexural modulus, making it an ideal canvas for custom circuit fabrication, hardware validation, and system prototyping.
1oz Standard Copper Layering and Surface Integrity
The board is clad with a uniform 1oz per square foot (approximately 35 microns) high-purity copper foil bonded firmly to the FR4 dielectric base. The smooth, oxidation-resistant copper surface ensures consistent thermal conductivity, low trace resistance, and excellent solderability across surface-mount (SMD) and through-hole designs. High peel strength prevents trace lifting during hand soldering or repeated rework cycles.
Versatile Fabrication and Etching Compatibility
Designed for rapid turnaround in lab, industrial, and workshop environments, this PCB blank supports a wide range of subtractive manufacturing processes. It is fully compatible with chemical wet etching using ferric chloride or sodium persulfate, as well as mechanical isolation routing on desktop CNC milling machines. Whether applying toner-transfer artwork, positive photoresist films, or direct UV mask printing, the flat substrate guarantees precise line-width control down to fine-pitch traces.
Applications and Thermal Resilience
With a dielectric constant optimized for general electronic applications and a glass transition temperature exceeding 130 degrees Celsius, this FR4 laminate excels under operational thermal stress. It is suitable for prototyping switch-mode power supplies, microcontroller breakout boards, analog signal conditioning modules, RF shields, and educational electronics projects requiring reliable signal integrity.
